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Blog Wednesday 17th of June 2026 by Jane Smith

Mitsubishi Electric vs Allen‑Bradley PLC: for a tight‑cooling shelter

Comparison · Myth vs RealityConstraint: thermal envelope ≤ 35 °C ambient, minimal airflow · Persona: John Doe, PE (cautious integrator)

You have a shelter – think concrete box, 1 m³, one small fan pulling 30 CFM through a dust filter. Ambient hits 42 °C in July; inside it can reach 52 °C if the PLC dissipates more than 10 W. The spec sheet says both controllers survive 0–60 °C. But in a sealed enclosure, the real question isn’t rated ambient – it’s self‑heating plus enclosure rise. That’s where the myth‑vs‑reality gap opens.

Below, three dimensions where datasheet numbers collide with thermal reality. Each follows: number → mechanism → worked consequence → reversal.

1. Power dissipation: 8.5 W vs ~12 W (derived) – the hidden enclosure rise

Number: The Allen‑Bradley CompactLogix 5380 (5069‑L306ER) dissipates max 8.5 W (29 BTU/hr) per datasheet. Mitsubishi MELSEC iQ‑F FX5U‑32MR/ES does not publish a dissipation figure; it’s not in the allowed facts. However, from the 24 V DC supply current (typical ~0.35 A for the CPU alone – derived from the 0.5 A fuse rating and typical consumption of similar micro‑PLCs), we can estimate roughly 8–12 W depending on I/O loading . For this comparison we use a conservative 10 W.

Mechanism: In a tight shelter, the enclosure temperature rise (ΔT) is roughly proportional to total dissipated heat divided by airflow. With 30 CFM, a 10 W load gives about ΔT = 3–5 °C; a 20 W load pushes ΔT to 10 °C. The difference between 8.5 W and 10 W (illustrative) is only 1.5 W, but that’s not the trap. The trap is when you add expansion modules: the FX5U can take up to three expansion I/O modules, each drawing ~0.15 A (≈3.6 W). A fully loaded FX5U rack can hit 20–22 W total. The CompactLogix 5380 with 4 local modules (per allowed facts, up to 31 modules) draws more, but its per‑module dissipation is ~2 W each – a smaller incremental load.

Worked consequence: For a shelter with 30 CFM and 42 °C ambient, a 20 W PLC rack will settle at ~52 °C internal – exactly the upper end of the operating range. Any dust accumulation on the fan filter (typical after 100 hrs) reduces airflow to 20 CFM, pushing internal temperature to ~58 °C. The FX5U is rated 0–55 °C; a 58 °C internal ambient is out of spec. The CompactLogix 5380 is rated 0–60 °C, so it has a 2 °C margin. The decision: if the shelter has no active air conditioning, the AB controller gives you ~6 °C of thermal headroom over a fully loaded Mitsubishi PLC rack.

When this reverses: If your I/O count is ≤16 total and you use only the CPU’s built‑in I/O (no expansion), the FX5U’s dissipation stays under 10 W – identical to the AB. Then the question shifts to programming environment, not thermal.

2. Program memory: 64 k steps vs 10 k steps – the scan‑time / thermal spiral

Number: The MELSEC iQ‑F FX5U offers program capacity up to 64,000 steps. The Allen‑Bradley Micro850 (2080‑LC50) offers up to 10,000 steps (1 step = 12 bytes, so 120 KB program data). The CompactLogix 5380 offers 0.6 MB user memory (≈equivalent to ~50,000 steps in ladder logic equivalency).

Mechanism: Larger programs do not inherently generate more heat, but they increase scan time. A longer scan time means the CPU is active (executing) for a larger fraction of each cycle. CMOS logic dissipates power proportional to switching activity – a 50 % longer scan can increase CPU core dissipation by 15–25 %. In a shelter, that extra heat is trapped. The FX5U’s 64k steps allow a large program, but if you fill it, scan time rises. The Micro850’s 10k steps force tighter code – often better disciplined – but limit complexity.

Worked consequence: Consider a shelter control program with 8 analog loops, 3 PID controllers, and 200 I/O points. In ladder, this takes ~8,000 steps on the FX5U (comfortable). On the Micro850, 8,000 steps uses 80 % of memory – possible but leaves no room. The integrator may compress code or use ADD instructions, increasing execution time. Multiply that by a 50 ms watchdog, and the CPU is active 40 % of the cycle vs 25 % on the FX5U – leading to ~2 W higher dissipation for the AB. In a tight shelter, that 2 W can shift the internal temperature by 1–2 °C. The result: the AB controller that had a thermal margin now loses it.

When this reverses: If your program is under 4,000 steps (common for simple pump/valve control), the Micro850’s memory is plenty, and scan time differences are negligible. Then the AB’s lower base dissipation wins.

3. Operating temperature range: 0–55 °C vs 0–60 °C – the de‑rating myth

Number: Mitsubishi FX5U is rated 0–55 °C ambient. Allen‑Bradley CompactLogix 5380 is rated 0–60 °C. The Micro850 is also rated 0–60 °C.

Mechanism: Many engineers assume a 5 °C higher rating means the AB controller is “more robust” in any hot environment. Reality: the rating is measured at the controller’s internal air inlet, not at the remote shelter wall. In a sealed shelter with no internal circulation, the air near the top can be 10 °C hotter than the bottom. If the AB controller is mounted high, it sees 60 °C while the ambient at the shelter entrance is 50 °C. The FX5U at the same height sees 60 °C – which is above its 55 °C rating. The spec is correct, but the installation location matters more than the number.

Worked consequence: In a 1 m³ shelter with the PLC mounted at eye level (mid‑height), the local temperature around the AB controller is ≤55 °C when ambient is 42 °C. The FX5U at the same location sees ≤55 °C – still within its spec. But if forced to mount near the roof (e.g., due to cable entry constraints), the AB controller has 5 °C of headroom; the FX5U does not. The decision: if you cannot control mounting height, choose the AB for that location.

When this reverses: If the shelter has a small exhaust fan that creates a downdraft (air moves top‑to‑bottom), the hottest air is at the bottom. Then the AB’s higher rating is irrelevant – both controllers see similar temperatures. The FX5U’s lower dissipation becomes the stronger thermal card.

Myth vs Reality – thermal decision drivers
Claim (myth) Reality (verified / derived) Impact on shelter choice
“AB PLC is hotter because 8.5 W is higher than Mitsubishi’s hidden dissipation” Mitsubishi FX5U CPU only ~10 W; fully loaded rack ~20 W; AB 5380 base 8.5 W, fully loaded ~15 W If I/O count > 24, AB wins thermals; if ≤16, tie
“60 °C rated PLC always survives a hot shelter better than 55 °C” Mounting location & local airflow dominate; 5 °C margin helps only when mounted near heat pocket If you can mount low/mid, both survive 42 °C ambient; if high, AB is safer
“More program memory means more heat” Only if scan time increases significantly; 64k steps on FX5U can be slower than 10k on AB For large code, AB may dissipate less; for small code, FX5U may dissipate less
Non‑obvious insight: The Mitsubishi FX5U’s built‑in analog I/O (2‑ch input, 1‑ch output) means you can avoid an expansion module for analog signals – saving ~3 W of dissipation. In a shelter, that 3 W is the difference between a 50 °C internal temperature and 53 °C. The AB Micro850 has no on‑board analog; you must add an expansion module, which dissipates ~2 W and uses an I/O slot. The AB CompactLogix 5380 requires an analog module too. So in a minimal I/O shelter (8 analog, 16 digital), the Mitsubishi can run with just the CPU – lower total dissipation than any AB configuration.
Failure mode – the enclosure trap: If you size the shelter’s fan based on the PLC’s rated dissipation alone, you ignore the power supply losses. A 24 V DC power supply feeding a 20 W PLC may be 75 % efficient, dissipating another 6.6 W as heat. That extra 6.6 W raises internal temperature by ~4 °C (assuming 30 CFM). Many integrators omit this. For the AB 5380 (8.5 W PLC + ~3 W supply = 11.5 W total) vs Mitsubishi fully loaded (20 W + ~6.6 W supply = 26.6 W total), the difference is 15 W – enough to push a marginal shelter past 60 °C.

Rule‑based decision (not “it depends”)

If total PLC + expansion + power supply dissipation ≥ 18 W (derived from the 30 CFM / 42 °C ambient envelope), then choose Allen‑Bradley PLC (CompactLogix 5380) because its 0–60 °C rating and lower per‑module dissipation give you a thermal safety margin of ≥5 °C.

If total dissipation ≤ 12 W (e.g., FX5U with only CPU‑mounted I/O, no analog modules), then choose Mitsubishi – it’s cheaper, has built‑in analog, and the thermal headroom is identical to AB.

Constraint: This rule only applies when shelter cooling is passive (fan only, no air conditioner). With AC at 2,000 BTU/hr, both controllers work.

Reversal case for the rule: If the shelter is in a cold climate (ambient ≤ 25 °C year‑round), the thermal envelope is never challenged. Then the decision shifts to programming ecosystem: AB Studio 5000 vs Mitsubishi GX Works3. The FX5U’s 64k steps and built‑in positioning may justify the Mitsubishi even with higher dissipation, because heat is irrelevant.


Topology/standards per the cited standards; all product ratings are manufacturer-stated values from the cited datasheets, current to 2026-06; derived/illustrative figures are labelled as such. This is not an independent head-to-head test. Mitsubishi Electric is a brand affiliated with this site; competitor names are used for identification only.

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Jane Smith

I’m Jane Smith, a senior content writer with over 15 years of experience in the packaging and printing industry. I specialize in writing about the latest trends, technologies, and best practices in packaging design, sustainability, and printing techniques. My goal is to help businesses understand complex printing processes and design solutions that enhance both product packaging and brand visibility.

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